Global Luxury Retailing: Market Size, Brand Strategies and Competitor Performance

Published: November 2011
No. of Pages: 267
Price: $ 4495

Following a steep but short decline in sales in 2009 the global luxury market is thriving once more. Affluent consumers are returning to premium brands, and those with newfound wealth are discovering them for the first time. Verdict forecasts that the Global Luxury Retailing market will grow 65% between 2010 and 2015. Discover the brands that are driving sales, and the key strategies being used to entice luxury shoppers.

Features and benefits

• Make informed regional investment decisions with luxury expenditure forecasts to 2015 based on inputs including the number of wealthy individuals.

• Make an informed decision what product categories to prioritise in terms of investment based on expenditure by product category forecasts to 2013.

• Benchmark your company's performance by accessing profiles of ten key luxury retailers including key operating details and their global market shares.

• Benchmark your company's performance in terms of your e-commerce proposition and find ways to improve your customers' online experience.

• Inform your pitches with top quality insights into the market supported by multiple primary interviews with senior managers at top luxury companies.

Browse All: Retail Market Research 

Highlights

• The global luxury goods market is forecast to expand by 65% from 2010 to 2015, with most of this growth coming from emerging economies, especially in Asia Pacific. China remains the key growth generator in the region, but new demand from other markets such as South Korea, Taiwan and to a lesser extent India also contributes to strong performance.

• Luxury retailers regard China as the top destination for international expansion, with many now aggressively expanding in the country. The focus is however on retail-led expansion to be better aware of new market developments, and dedicating extra effort in boosting brand image through dedicated products, fashion events and destination stores.

• Despite previously having been skeptical about e-commerce, now the majority of luxury houses have at least some online offer. However, there remains much confusion about how to guarantee a premium service online and many luxury retailers have missed the opportunity to use their transactional sites to further bolster customer engagement.

SiC Market

Published: November 2011
Price: $ 4900


SiC INDUSTRY CONSOLIDATION AND RESHAPING HAS STARTED
SiC Market - SiC device makers now offer the 2 most expected devices in the power electronics industry: the diode and the transistor. 2011 is the year of the first SiC MOSFET introduction with simultaneous offers from Rohm and CREE.
These devices are used in real systems (air conditioners, motor drives, PV inverters…) and significant effort is being directed toward the packaging side to capture all the added-value of the SiC (High T°, high frequency….)

Thus, the open SiC device market has exceeded $50M in 2010 (excludingdefense-related and R&D contracts) with an unexpectedly high penetration in the PV inverter segment where SiC Schottky diodes are now implemented in numerous systems, taking about 15% of the SiC device sales. PFC systems are still the top SiC device sales.

The pending question remains the same: will SiC be implemented in EV/HEV and when? Here several scenarios may be envisioned. In our optimistic scenario, the automotive-related business will start by 2014 with a fast ramp-up and will capture more than 65% of the SiC device business in 2020. On the other hand, in our pessimistic scenario SiC could be skipped by auto makers who may prefer GaN or incumbent Silicon technology.

Browse All: Semiconductor Market Research

The investment level in the SiC industry has never been so huge: Over $100M has been invested in M&A, R&D programs, private and public funding over 2010 and early 2011.
Very recently the SiC industry has also started to consolidate through M&A, large investments or license agreements. Over the last 18 months, the most significant were:
• Rohm – SiCrystal: acquisition
• Power Integration – SemiSouth: large investment
• Fairchild – TranSiC: acquisition
• Cree – Nippon Steel Corp.: license agreement
• SKC – Crysband: acquisition
• Infineon – SiCed: 100% acquisition

HIGH VOLTAGE: HUGE POTENTIAL BUT FEW PLAYERS…
We definitely assume that the safe area for SiC technology will be the high and very high-voltage applications (1.7kV to 10kV+) where GaN cannot easily go and where incumbent Silicon technologies are slowly reaching their limits. In the 10kV and more, SiC could be the dominant solution. However, and paradoxically, few players are targeting that high-voltage region, probably because the existing market is small (about  $2B TAM), unclear time-to-market and limited number of applications.

6” IS READY BUT NOT ACCESSIBLE IN VOLUME
Although 6” SiC wafer capacity is now ramping-up for LED production at CREE, the power industry is not yet able to access it in volume. We expect 2012 to be the starting point for a wide diffusion of this 150mm substrate that should act as an incentive for the remaining reluctant companies, arguing that SiC wafers are not compatible with their existing tool-kit.

IS SIC SELF-PROTECTED AGAINST GAN MARKET PENETRATION?
In most of our investigations, GaN is always mentioned as THE competing technology that can disrupt the expected natural and organic growth of the SiC business. Originally we though GaN devices could have created turbulence in the SiC area starting from 2010, by proposing 600V devices with a tip-point at 1.2kV. However it seems that the technology achievements have been delayed compared to the previous roadmap and only 200V GaN device are available in volume as of now. Thus, at the moment, the 600V blurry region where SiC and GaN are supposed to fight is safe for SiC as no device can compete yet.

LIFE AND DEATH: IS CHINA THE NEW ELDORADO FOR SIC BUSINESS ESTABLISHMENT?
Of the 7 new entrants listed in the last 12 months, 4 were established in China and 3 among them were dedicated to material (raw wafer and/or epi). Epiworld, TianYue and TYSTC have invested extensively in top-class equipment to produce both SiC wafers and epiwafers. Kingway Technology will be active in the device area with a double entry: SiC and GaN from epi to device.
2 startups have ambitions of SiC device activity: Anvil Semiconductors in the UK and Ascatron, a spin-off from Swedish ACREO.
On the exit side, we have noticed the NeoSemiTech decision to cut its SiC activity as well as the 100% acquisition of SiCed by Infineon (formerly owned jointly with Siemens)

WHO SHOULD BUY THIS REPORT ?
• Equipment and material manufacturers:
• Analysis of the structure of the SiC industry and evolution of the industrial food chain
• Calculation of wafer volumes to be produced including diameter evolution forecast for each market segments
• Description of the processes and linked equipment and material markets
• Benefits of the report for the SiC devices manufacturers:
• Analysis of the current applications and detailed analysis of the future businesses
• Analysis of the competition from large companies to small start up
• Volumes and prices forecasts
• Alternative solutions analysis to the use of SiC devices

Emerging Markets for Microfluidic Applications (EMMA 2011)

Published: November 2011
Price: $ 5450


Report Summary
• Microfluidics has entered the Life Sciences market as a key technology to provide solution adapted to the market requirements.
• The microfluidic device market is promising and should reach $4 Billion in 2016. Yole Développement follows innovations and key players in this market for several years. This is a fast evolving market, starting its structuration and consolidation phase. Combined analysis of the technologies, key players, markets and requirements is essential to understand this market dynamics.
• Emerging Markets for Microfluidic Applications (EMMA 2011) report provides a complete analysis of Microfluidic device markets and technologies. Based on a accurate analysis of what happened over the last three years, this report consolidates market data for 2008-2010 and provides forecasts for 2010-2016.

Browse All: Electronics Market Research

MARKET SEGMENTATION
It’s worth noting that there are several applications for Microfluidics technologies in Life science fields but the boundaries are often blurred. Based on a rigorous segmentation, Yole’s analysts have been able to gather all the information necessary to understand market needs for each application. EMMA 2011 report provides trends and key elements in term of technical and commercial aspects in order to success in your Microfluidic Business.

It describes the following applications:
• General Dispensing
• Drug Delivery
• Accurate Dispensing
• Analytical Devices
• Clinical and veterinary diagnostics
• Point Of Care testing
• Industrial & environmental testing
• Pharmaceutical and life science
• Microreaction technology
Each of them are developed with market data, trends and drivers, keys players and technologies used.

The microfluidic applications market enters a phase where many products move from prototyping to production. Many new players entered the supply chain recently, bringing in their expertise in the mass production of electronic devices and modules. Will these players manage the challenge of reducing the production costs and make disposable microfluidic devices accessible for the medical market?
• MICROFLUIDIC SUPPLY CHAIN
The report describes the microfluidic supply chain, from R&D to commercialization and distribution. It shows for each type of material the main players and their role in the supply chain.
• MICROFLUIDIC VALUE CHAIN
The analysis of the value chain provides an understanding of costs related to the different manufacturing steps (included packaging and quality control) in relation to the cost of the final product which includes reagent, commercialization and distribution costs.

KEY FEATURES OF THE REPORT
• Consolidation of 2008-2010 market data based on the top 150 microfluidic players results
• Analysis of the last 3 years market evolution and key events, such as mergers & acquisitions, innovative product launch, found rising, patents…
• 2010-2016 Microfluidic device forecasts with a unique market segmentation of the different applications.
• Detailed supply and value chain analysis putting in evidence the value of material and structuring in the complete value chain.

WLCSP Market & Industrial Trends

Published: November 2011
Price: $ 5790



Growth rate is still high, but the market shows early signs of maturity
Many “WLP” technologies are now cruising at a very high altitude. This is serious business: over 23 billion units packaged with ‘fan-in’ as we may call it are expected to sell and be mounted in smartphones, tablet PCs or other mobile devices in 2011. For size reduction, together with low cost, remains the main driver for adoption of this technology. If ‘fan-in’ WLCSP already reached high penetration rates in mobile applications for connectivity (Bluetooth+WLAN+FM combos, GPS) and analog integrated circuits (DC/DC converters, LDO's, ESD/EMI protection devices), it is still growing fast for some other IC types as well as in MEMS and sensors. We are not at a time to claim that “Wafer Level Packaging” is taking off any longer.

Reaching over 2 million 300mm equivalent ‘fan-in’ WLCSP wafers in 2011 for a total market size of b$1.7
Of course, one may argue that these are tiny devices. Well, if this is true for many of them, it appears that the average size of a ‘fan-in’ WLCSP device tended to increase over the past 2 years, with many “connectivity” devices reaching sizes of more than 30mm2. We estimate that in 2011, more than 2.3 million 300mm equivalent ‘fan-in’ WLCSP wafers will be processed for the first time. All steps compounded (wafer level, die level and test), we estimate that the 2011 market value of ‘fan-in’ WLCSP is close to B$ 1.7.
Prices keep on decreasing, but the market growth rate is expected to stay high at 12% over the 2010-2016 time period

Although costs and prices still decrease as the technology and its market mature, the market value growth rate for the 2010-2016 timeframe is still expected around 12%, 4 points higher than semiconductor packaging in general. However, this is lower than the 22% 2008-2013 growth rate we had computed for the same market 2 years ago. Costs kept on decreasing thanks to the end of the capacity shortage on 12-inch diameter wafers and thanks to standardizing technologies with simplified process flows. And despite technologies improved to the point that the maximum possible die size could be extended, it's not all clear skies for ‘fan-in’ WLCSP. With the continuous fallout of Nokia on the handsets market, this is WLCSP's historical biggest supporter which loses influence, and some tier two handset manufacturers still seem reluctant to broadly adopt the technology.

Changing paradigms: future growth will be driven by different devices, based on different technologies
Looming over the horizon is the threat of the CMOS 28nm node technology with such a high IO density that some package with a “fan-out area” will be needed anyhow. Hopefully, A significant part of the ‘fan-in’ WLCSP market still relies on the analogue ICs on the one hand, using older technologies, and on MEMS and sensors (particularly CMOS image sensors) on the other hand. This latter device type is expected to be a high potential growth application for fan-in WLCSP in the coming 5 years: we expect a tremendous growth of up to 25% for MEMS and sensors with a WLCSP finishing over the next 5 years. All in all, ‘fan-in’ WLCSP shows the first early signs of a maturing market. It still grows faster than the average semiconductor packaging market mainly thanks to the fast growth rates of smartphones and tablet PCs in which WLCSP considerably helps save space and reduce costs.

Browse All: Electronics Market Research Reports

High margins are attracting new player types with diverse business models
The supply chain is still primarily led by OSATs and IDMs, But the original “Wafer bumping houses” and “wafer packaging houses” take a significant share of the market too. All the major OSATs invested in 300mm WLCSP capacity over the past 2 years. TSMC recently claimed their will to step in this market too, possibly opening the way to other foundries.

 In this WLCSP 2011 report, you will find detailed technical and market status and forecasts on WLCSP technologies and applications. Market forecasts and growth rates are provided based on device units and wafers for each market segment over the 2010-2016 timeframe. Market value forecasts in dollars are given over the same period of time. Based on our “bottom-up” analysis of the WLP fabs, the report displays the list and ranking of the WLCSP front-end (RDL, UBM and balling) players as of end of 2010, including the detailed respective wafer production capacities by player and wafer type.

Our unique “bottom-up meets top-down analysis” cross checks our forecasting models application by application, and player by player, delivering a high definition picture of the status of the ‘fan-in’ WLCSP market, with, for example, the level of loading of the major WLCSP fabs by application and by IC design company.

Numerous application examples are given, recent technical developments on materials, architectures and test are detailed, and industry-wide technology roadmaps are presented. In addition, the report provides for the analysis of the supply chain and a detailed cost analysis section with models and examples.

BENEFITS
Key features of the report
• Detailed account of all the application fields of WLCSP (examples DC/DC converters and LDO's, connectivity ‘WLAN+Bluetooth+FM’ combos, GPS, audio codecs and amplifiers, MEMS, CMOS image sensors ...)
• Market trends and figures in Munits, M$, and wafer size equivalent with breakdown by application.
• Wafer price ranges of WLCSP contract assembly by wafer size and breakdown by main process step (wafer level, die level and test)
• Complete technologies and material tool-box analysis, covering ‘fan-in’ WLCSP as well as 3DWLCSP of MEMS devices and sensors.
• Market Shares
Who should buy this report?
• Integrated semiconductor Device Manufacturers and fabless semiconductor companies
• Get the list of the top WLCSP service providers.
• Benchmark the competition activity and choose the right package for your future applications
• Assembly and Test Service companies and wafer bumping houses
• Assess your technical and market position in the WLCSP service market.
• Get the list of the main WLCSP users
• Get acquainted with upcoming technologies and their potential
• Plan ahead needed investments for capacity
• Electronic module makers and Original Equipment Makers
• Evaluate the benefits of using these new technologies in your end system.
• Monitor new WLCSP application trends and package developments
• Equipment and Material manufacturers
• Identify new business opportunities and prospects
• Understand the differentiated value of your products and technologies in this market
• IC and MEMS Foundries
• Spot new opportunities and define diversification strategies

Companies cited in the report
Accretech, advantest, agilent technologies, Alphaprobes, Amkor, AMS, Anadigics, Analog Devices, AnalogicTech, Apple, Applied Materials, Asahi Kasei (AKM), ASE, Audience, Avago Technologies, Bosch, Broadcom, Cascade Microtech, Casio Micronics, China WLCSP, Cirrus Logic, CSR, Cypress, Delphi, Dialog Semiconductors, Discera, DNP, Dow, Dupont, electroglas, Ellipsiz, EPWorks, Fairchild, FCI, Form factor, Fraunhofer IZM, Freescale, Fujikura, Fujitsu, Google, Hamamatsu, Hynix, ICI, Idex, IDT, IDT, IME, imec, Infineon, International Rectifier, Intersil, Invensense, JCAP, JEM, JSR Micro, LAM Research, LB Semicon, Lenovo, LETI, Linear Technology, LTX/Credence, Marvell, Maxim, Maxlinear, Microchip, Micron, Micronics, Mitsubishi Chemical, Mosart, Motorola, Murata, National Semiconductors, Nemotek, Nepes, Nexx, Nippon Steel, Materials, Nokia, NXP, OKI, Okmetic, Omnivision, On semiconductor, Optopac, PacTech, Panasonic, Panasonic, PowerTech (PTI), Qualcomm, Renesas, Rhom, RIM (Blackberry), Samsung, Sanyo, Sensonor, Sharp, Shibasoku, Shin-Etsu, Shinko, Silecs, Silex, Siltech, SiTime, SMSC, Sony, SPIL, SPTS, StatsChipPac, STEricsson, STMicroelectronics, Sumitomo, Suss Microtec, TDK-Epcos, technoprobe, TEL, Teledyne/Dalsa, teradyne, TeraMikros, TeraProbe, Texas Instruments, Toray, Toshiba Semiconductors, Tronics, TSMC, UMC, Unisem, verigy, Visera, VTI, Wentworth laboratories, Wolfson Microelectronics, Xintec, Yamaha, Yokogawa

About the authors
Jean-Marc Yannou joined Yole Développement as technology and market expert in the fields of advanced packaging and Intergrate Passive Devices. He has 15-years of experience in the semiconductor industry.

Lionel Cadix joined Yole after the completion of several projects linked to the characterization and modeling of high density TSV and 3DIC chip stacking in collaboration with CEA-Leti and STMicroelectronics during his PhD.

ABOUT YOLE DÉVELOPPEMENT
Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to fi nance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 40 associates worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic.

Outlet Center Retailing in Europe: Major Players, Strategies and New Opportunities

Published: November 2011
No. of Pages: 131
Price: $ 3450


Discount destinations provide consumers with luxury and high street brands at prices reduced by 30-70%, and the format continues to perform strongly across the EU27. This report outlines the size of the outlet market and identifies growth markets based on new openings. It also provides insight into the issues impacting the sector and profiles the largest EU outlet operators.

Features and benefits
Outlet Center Retailing in Europe
• Select the most suitable outlets for your retail operations by uncovering where they are located and their current mix of retail tenants by sector.
• Inform national business development strategies by uncovering key indicators across each of the EU27 markets, such as outlet space per 1000 consumers.
• Exploit opportunities and mitigate risks by gaining insight into the issues impacting retailers and brands distributing through factory outlets.
• Select an outlet operator for partnership by using our detailed profiles of the five largest players which includes their locations and strategies.
• Maximise sales at your outlets by uncovering how competitors have been driving footfall by attracting tourists, and providing food and entertainment.

Browse All: Retail Market Research

Highlights
• The UK outlet market is the most heavily developed in the EU. The country contains 55 outlets and has 14.0 sq m of outlet space per 1,000 people. Romania has the least developed discount outlet market in the region with only 1.3 sq m of outlet space per 1,000 people, however there are three new outlets in development.
• Operating stores in outlet centers allows retailers to target a wider shopper audience however they must be careful not to cannibalise sales from full price stores. Many open outlet stores where they don't have any stores nearby and others are selling products that were not available in the full price stores within the national market.
• McArthurGlen is the EU's largest pan-European outlet operator managing 20 outlet centers across five European markets. While other regional outlet operators are turning their attention to countries within the Asia Pacific region, McArthurGlen intends to develop its EU markets building new outlets in Germany and France.